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《Virtual and Physical Prototyping》杂志封面

《Virtual and Physical Prototyping》中科院JCR分区

  • 2025年3月升级版:
  • 大类小类学科Top综述期刊
    工程技术 1区
    ENGINEERING, MANUFACTURING
    工程:制造
    2区
    MATERIALS SCIENCE, MULTIDISCIPLINARY
    材料科学:综合
    2区

  • 2023年12月升级版:
  • 大类小类学科Top综述期刊
    工程技术 1区
    ENGINEERING, MANUFACTURING
    工程:制造
    2区
    MATERIALS SCIENCE, MULTIDISCIPLINARY
    材料科学:综合
    2区

    《Virtual and Physical Prototyping》期刊简介:

    Virtual and Physical Prototyping is online only. We welcome authors to submit supplementary data sets, colour images, animation and videos to publish with your articles to enhance the content experience of the journal.

    Virtual and Physical Prototyping provides an international forum for professionals and academics to exchange novel ideas and disseminate knowledge covering the full range of activities related to the multi-disciplinary area of virtual and rapid prototyping.
    The scope of VPP includes:
    Design for additive manufacturing: topological optimisation, lightweight, biomimetic design, functionally graded structures, etc.
    4D printing: smart materials, shape memory polymers/alloys, deployable structures, etc.
    Multi-material printing: 3D printing of multiple metals, polymers, ceramics, composites, etc.
    Hybrid manufacturing: combination of additive and subtractive technologies
    Functional 3D printing: functional design, functional prototyping, etc.
    As well as the following topics:
    CAD and 3D data acquisition technologies
    Virtual environments and virtual reality
    Rapid tooling and rapid manufacturing
    Quality control and AM standards
    Concurrent engineering
    Bioprinting and biofabrication
    Concrete printing
    Miscellaneous: e-manufacturing/Internet of things, legal perspectives, economics, social and environmental implications, case studies, etc.
    All published research articles in this journal have undergone rigorous peer review, based on initial editor screening and anonymous refereeing by independent expert referees.

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